BGA (Ball Grid Array)

CBGA (Ceramic)

FCBGA

PBGA (Plastic)

SBGA (w/Heatsink)

          CSP (Chip Scale Package)

CSP BGA (Ball Grid Array)

LFCSP (LeadFrame)

LGA (Land Grid Array)

Tape CSP BGA

WLCSP (Wafer Level)

          DIP (Dual Inline Package)

CerDIP (Ceramic)

CerDIP - Side or Bottom Brazed

CerPAK - Gullwing Leads

Metal or Hybrid DIP

PDIP (Plastic)

FlatPack

Ceramic Flat Package

Header

TO-92 (Plastic Header)

TO-XX (Metal Header)

       LCC (Leaded or Leadless Chip Carrier)

CLCC - Gullwing Leads

J leaded CLCC

LCC (Leadless Ceramic)

LDCC (Leaded Ceramic)

PLCC (Plastic, Leaded)

PLCC w/heat sink

         PGA (Pin Grid Array)

Ceramic Pin Grid Array

           QFP (Quad Flat Pack)

CQFP (Ceramic)

LQFP 1.4mm thick

LQFP w/heat sink

MQFP

MQFP - Thermally Enhanced

TQFP (Thin, 1.0mm)

TQFP - Thermally Enhanced

         SIP (Single Inline Package)

SIP Gullwing Leads

SIP Horizontal Leads

SIP Vertical Leads

          SOIC (Small Outline IC)

PSOP (SOIC w/heatslug)

SOIC (Narrow)

SOIC (Wide)

           SOP (Small Outline Package)

MSOP (micro-SOIC)

QSOP (25mil pitch)

SSOP (Shrink SO)

Thermally Enhanced [PSOP/2]

TSSOP (Thin, 1.2mm)

TSSOP_EP

           SOT (Small Outline Transistor)

SC-70

SOT-143

SOT-223

SOT-23

SOT-66

TSOT-23 (Thin, 0.9mm)